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Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are abso-
lute voltages referenced to COM.
Parameter
High side floating supply offset voltage
High side floating supply voltage
High side floating output voltage
Low side output voltage
Supply voltage
Input voltage for IN
Input injection current. Full function, no latch
Symbol
V S
V B
V HO
V LO
V CC
VIN
I IN
Min.
V B -25
-0.3
Vs-0.3
-0.3
-0.3
-0.3
-
Max.
V B +0.3
625
V B +0.3
V CC + 0.3
25
V cc +0.3
+1
Unit
V
V
V
V
V
V
mA
up;(Guaranteed by design). Test at 10V and
17V on Eng.Samples
Power Dissipation
Thermal resistance, junction to ambient
Electrostatic discharge voltage
(Human Body Model)
Charge device model
Junction Temperature
Pd (1)
Rthja (1)
V ESD
V CDM
Tj
1K
500
0.625
200
150
W
? C/W
V
V
? C
Storage Temperature
T S
-55
150
? C
Note: 1) The thermal resistance and power dissipation rating are measured bellow conditions;
JESD51-2: Integrated Circuit Thermal Test Method Environmental Conditions - Natural convection(StillAir)
JESD51-3 : Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Package
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions.
Parameter
Symbol
Min.
Max.
Unit
High side floating supply voltage(DC)
VB
(1)
V S + 6
V S + 20
V
Transient:-10V@ 0.1 us
High side floating supply offset voltage(DC)
V S
-5
600
V
Transient: -25V(max) @0.1us @VBS<25V
High side floating output voltage
Low side output voltage
V HO
V LO
Vs
0
V B
V CC
V
V
Allowable offset voltage Slew Rate
Supply voltage for logic part
Logic input voltage
(3)
Switching Frequency
Ambient Temperature
(2)
dv/dt
V CC
V IN
F s
T a
-
5.5
0
-40
50
20
V cc
200
125
V/ns
V
V
KHz
? C
Note: 1) The Vs offset is tested with all supplies biased at 15V differential.
2) Guaranteed by design.
3) When VDT= 1.2V.
?2012 Fairchild Semiconductor Corporation
FAN7080_GF085 Rev. 1.0.1
3
www.fairchildsemi.com
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